The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Mar. 28, 2018
Applicant:

Horiba Stec, Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventors:

Sotaro Kishida, Kyoto, JP;

Junya Nakai, Kyoto, JP;

Takehisa Hataita, Kyoto, JP;

Akira Kuwahara, Kyoto, JP;

Assignee:

HORIBA STEC, Co., Ltd., Kyoto-shi, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01L 9/00 (2006.01); G01L 19/14 (2006.01); G01L 19/06 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0072 (2013.01); G01L 19/0627 (2013.01); G01L 19/147 (2013.01);
Abstract

The pressure sensor comprises the diaphragm, an electrode body, a housing, an inlet pipe, and a thermal buffer member. The diaphragm includes a pressure receiving surface configured to receive a pressure of a measured target fluid. The electrode body includes an electrode surface facing a rear surface of the pressure receiving surface with a gap interposed therebetween. The housing supports the diaphragm so as to form a measuring chamber by surrounding the pressure receiving surface. The inlet pipe is coupled to the housing and configured to guide the measured target fluid into the measuring chamber. The thermal buffer member is disposed on the inlet pipe and has a predetermined heat capacity. Accordingly, the diaphragm is unlikely to bend due to a rapid temperature change in a fluid guiding pipe disposed a fluid line.


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