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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10718379 B1

PDFFull Text
Date of Patent:
Jul. 21, 2020

Filed:

Sep. 02, 2015

Slide member and method for manufacturing same

Applicant:

Ntn Corporation, Osaka, JP;

Inventors:

Yousuke Sugai, Aichi, JP;

Yoshinori Ito, Aichi, JP;

Toshihiko Mouri, Aichi, JP;

Assignee:

NTN CORPORATION, Osaka, JP;

Attorney:

Wenderoth, Lind & Ponack, L.L.P.

Primary Examiner:

David Sample

Assistant Examiner:

Elizabeth Collister

Int. Cl.
CPC ...
F16C 33/12 (2006.01); B22F 3/24 (2006.01); F16C 17/02 (2006.01); B22F 7/00 (2006.01); B22F 7/06 (2006.01); C22C 38/00 (2006.01); B22F 5/10 (2006.01); B22F 3/10 (2006.01); F16C 33/14 (2006.01); F16C 33/10 (2006.01); B22F 1/00 (2006.01); B22F 3/16 (2006.01); B22F 5/00 (2006.01); B22F 7/02 (2006.01); C22C 38/08 (2006.01); C22C 38/12 (2006.01); C22C 38/16 (2006.01);
U.S. Cl.
CPC ...
F16C 33/12 (2013.01); B22F 1/0003 (2013.01); B22F 3/1035 (2013.01); B22F 3/16 (2013.01); B22F 3/24 (2013.01); B22F 5/00 (2013.01); B22F 5/106 (2013.01); B22F 7/00 (2013.01); B22F 7/02 (2013.01); B22F 7/06 (2013.01); C22C 38/00 (2013.01); C22C 38/08 (2013.01); C22C 38/12 (2013.01); C22C 38/16 (2013.01); F16C 17/02 (2013.01); F16C 33/104 (2013.01); F16C 33/121 (2013.01); F16C 33/128 (2013.01); F16C 33/14 (2013.01); F16C 33/145 (2013.01); B22F 2003/166 (2013.01); B22F 2005/103 (2013.01); B22F 2301/00 (2013.01); B22F 2301/10 (2013.01); B22F 2302/45 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01);
Abstract

A sliding member () is formed of a sintered compact. The sintered compact includes: a base layer (), which mainly contains an Fe-based structure and further contains 1.0 wt % to 5.0 wt % of Cu, a metal having a melting point lower than a melting point of Cu, and C; and a sliding layer (), which is sintered together with the base layer () in a state of being held in contact with the base layer () and has a sliding surface (A). The sliding layer () mainly contains an Fe-based structure containing at least one kind of alloy element selected from Ni, Mo, Mn, and Cr and further contains Cu and C, and the content of Cu in the sliding layer () is larger than the content of Cu in the base layer.

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