The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Jun. 15, 2017
Applicant:

United Technologies Corporation, Farmington, CT (US);

Inventors:

Conway Chuong, Manchester, CT (US);

Tara L. D'Ambruoso, Oxford, CT (US);

Michael DiFrancesco, Waterbury, CT (US);

Assignee:

Raytheon Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F02C 7/28 (2006.01); F01D 11/02 (2006.01); F16J 15/44 (2006.01); F01D 25/04 (2006.01); F01D 11/00 (2006.01);
U.S. Cl.
CPC ...
F02C 7/28 (2013.01); F01D 11/025 (2013.01); F01D 25/04 (2013.01); F16J 15/442 (2013.01); F01D 11/001 (2013.01); F01D 11/02 (2013.01); F05D 2230/237 (2013.01); F05D 2240/55 (2013.01); F05D 2300/121 (2013.01); F05D 2300/522 (2013.01);
Abstract

A non-contact seal assembly is provided. The non-contact seal assembly includes a plurality of seal shoes arranged about a centerline in an annular array, the seal shoes including a first seal shoe extending axially along the centerline between a first shoe end and a second shoe end; a seal base circumscribing the annular array of the seal shoes; and a plurality of spring elements, each of the spring elements radially between and connecting a respective one of the seal shoes with the seal base, where the seal base and the plurality of spring elements are formed of a first material and the plurality of seal shoes are formed of a second material, where the first and second materials are joined together and the second material has a density lower than the first material.


Find Patent Forward Citations

Loading…