The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Feb. 24, 2016
Applicant:
Hitachi Metals, Ltd., Tokyo, JP;
Inventors:
Shohei Hata, Mito, JP;
Takayuki Tsuji, Kitaibaraki, JP;
Hiromitsu Kuroda, Hitachi, JP;
Keisuke Fujito, Mito, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C22C 1/02 (2006.01); C22F 1/08 (2006.01); B22D 11/00 (2006.01);
U.S. Cl.
CPC ...
C22C 9/00 (2013.01); B22D 11/004 (2013.01); C22C 1/02 (2013.01); C22F 1/08 (2013.01);
Abstract
A copper alloy material production method is provided. A copper raw material including not higher than 30 ppm by mass of oxygen is melted to form a molten copper. Not lower than 4 ppm by mass and not higher than 55 ppm by mass of titanium is added to the molten copper. After the adding of the titanium, not lower than 100 ppm by mass and not higher than 7000 ppm by mass of magnesium is added.