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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10717896 B1

PDFFull Text
Date of Patent:
Jul. 21, 2020

Filed:

Jun. 20, 2017

Curable heat radiation composition

Applicant:

Showa Denko K.k., Minato-ku, Tokyo, JP;

Inventors:

Yoichiro Sakaguchi, Tokyo, JP;

Kentarou Takahashi, Tokyo, JP;

Keisuke Mameda, Tokyo, JP;

Assignee:

SHOWA DENKO K.K., Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Jeffrey M Wollschlager

Assistant Examiner:

Armand Melendez

Int. Cl.
CPC ...
C08K 3/38 (2006.01); C09D 163/00 (2006.01); H01L 23/373 (2006.01); H01L 23/495 (2006.01); C08K 3/22 (2006.01); H05K 7/20 (2006.01); H01L 23/36 (2006.01); H01L 23/433 (2006.01); H01L 23/24 (2006.01); H01L 23/29 (2006.01); C08K 3/28 (2006.01); C09D 133/14 (2006.01); C09J 5/06 (2006.01); C08K 3/40 (2006.01); C09D 133/00 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/38 (2013.01); C08K 3/40 (2013.01); C09D 133/00 (2013.01); C09D 133/14 (2013.01); C09J 5/06 (2013.01); H01L 23/24 (2013.01); H01L 23/295 (2013.01); H01L 23/36 (2013.01); H01L 23/3737 (2013.01); H01L 23/4334 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H05K 7/20481 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); H01L 23/3107 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/451 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48096 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01); Y10T 156/10 (2015.01); Y10T 428/2848 (2015.01); Y10T 428/31511 (2015.04);
Abstract

The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).

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