The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

May. 22, 2018
Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Mayumi Sato, Tokyo, JP;

Koji Abe, Tokyo, JP;

Hideo Takahashi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); C09D 133/12 (2006.01); G06F 3/044 (2006.01); C09D 4/00 (2006.01);
U.S. Cl.
CPC ...
C09D 133/12 (2013.01); C09D 4/00 (2013.01); G06F 3/044 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01); Y10T 428/24802 (2015.01);
Abstract

A mobile phone including a touch panel including a base material; a sensing region including at least one electrode provided over the base material; and a frame region provided at a periphery of the sensing region, the frame region including metal wiring provided over the base material and being electrically connected to the at least one electrode; and a cured product of a photosensitive resin composition disposed at least on the metal wiring, the photosensitive resin composition contains a component (A): a binder polymer, a component (B): a photopolymerizable compound, and a component (C): a photopolymerization initiator; and the component (B) includes a di(meth)acrylate compound having at least one selected from the group consisting of a dicyclopentanyl structure and a dicyclopentenyl structure.


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