The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Jun. 24, 2015
Applicant:
Idemitsu Kosan Co., Ltd., Tokyo, JP;
Inventor:
Hirofumi Kondo, Chiba, JP;
Assignee:
IDEMITSU KOSAN CO., LTD., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); C09D 11/03 (2014.01); C09D 11/38 (2014.01); H05K 1/09 (2006.01); H01B 1/22 (2006.01); C09D 11/037 (2014.01); C09D 11/033 (2014.01); C09D 11/322 (2014.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); C09D 11/03 (2013.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); C09D 11/38 (2013.01); H01B 1/22 (2013.01); H05K 1/092 (2013.01); H05K 2201/0203 (2013.01); H05K 2203/122 (2013.01);
Abstract
A conductor composition ink of the invention includes: (A) a fluorine-containing compound to form a self-assembled monomolecular film; (B) metal particles; and (C) a solvent.
Kondo, Hirofumi. (2020). Conductor composition ink, conductor, laminate, laminated wiring board and electronic equipment (U.S. Patent No. 10717889). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10717889
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile