The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Aug. 16, 2018
Applicant:

Ems-patent Ag, Domat/Ems, CH;

Inventors:

Etienne Aepli, Domat/Ems, CH;

Botho Hoffmann, Domat/Ems, CH;

Assignee:

EMS-PATENT AG, Domat/EMS, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 69/32 (2006.01); C08J 5/18 (2006.01); C08K 7/14 (2006.01); C08K 3/40 (2006.01); B32B 27/34 (2006.01); C08G 69/26 (2006.01); C08G 69/36 (2006.01); C08L 77/06 (2006.01); B29K 509/08 (2006.01); B29C 45/14 (2006.01); B29K 677/00 (2006.01); B29K 77/00 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
C08G 69/32 (2013.01); B32B 27/34 (2013.01); C08G 69/265 (2013.01); C08G 69/36 (2013.01); C08J 5/18 (2013.01); C08K 3/40 (2013.01); C08K 7/14 (2013.01); C08L 77/06 (2013.01); B29C 45/14508 (2013.01); B29K 2077/00 (2013.01); B29K 2509/08 (2013.01); B29K 2677/00 (2013.01); B32B 27/08 (2013.01); C08J 2377/10 (2013.01); C08L 2205/025 (2013.01);
Abstract

The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 40 to 95 wt % of a specific polyamide mixture consisting of the polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.540 to 1.600; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% wt %; wherein the at least one transparent polyamide (A2) has a transparency of at least 90% and a haze of at most 3%. The present invention additionally relates to molded bodies composed of this polyamide molding compound.


Find Patent Forward Citations

Loading…