The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Apr. 30, 2014
Applicant:

SK Chemicals Co., Ltd., Gyeonggi-do, KR;

Inventors:

Seol-Hee Lim, Seoul, KR;

Sung-Gi Kim, Gyeonggi-do, KR;

Assignee:

SK Chemicals Co., Ltd., Seongnam, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 63/672 (2006.01); C08G 63/199 (2006.01); C08J 5/18 (2006.01);
U.S. Cl.
CPC ...
C08G 63/672 (2013.01); C08G 63/199 (2013.01); C08J 5/18 (2013.01); C08J 2367/02 (2013.01);
Abstract

A polyester based copolymer resin which can be used a heat shrinkable film is disclosed. The polyester based copolymer resin includes a dicarboxylic acid-derived residue including a residue derived from an aromatic dicarboxylic acid, and a diol-derived residue including a residue derived from 4-(hydroxymethyl)cyclohexylmethyl 4'-(hydroxymethyl)cyclohexane carboxylate and a residue derived from 4,4-(oxybis(methylene)bis) cyclohexane methanol. The heat shrinkable film including polyester based copolymer resin has a shrinkage initiation temperature of 60° C. or less, the maximum heat shrinkage rate at 60° C. of 4% or more, and the maximum heat shrinkage rate at 90° C. of 80% or more.


Find Patent Forward Citations

Loading…