The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
May. 30, 2013
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Keisuke Shimizu, Kanagawa, JP;
Nozomi Kimura, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B32B 38/00 (2006.01); B32B 37/12 (2006.01); B32B 9/04 (2006.01); B32B 15/20 (2006.01); B32B 27/16 (2006.01); B32B 15/08 (2006.01); B32B 7/12 (2006.01); B32B 37/00 (2006.01); B32B 38/10 (2006.01); H01B 1/18 (2006.01); B32B 37/20 (2006.01);
U.S. Cl.
CPC ...
B32B 38/0008 (2013.01); B32B 7/12 (2013.01); B32B 9/007 (2013.01); B32B 9/045 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/16 (2013.01); B32B 37/0053 (2013.01); B32B 37/025 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); H01B 1/18 (2013.01); B32B 37/20 (2013.01); B32B 2037/1253 (2013.01); B32B 2038/0076 (2013.01); B32B 2250/02 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2255/28 (2013.01); B32B 2307/202 (2013.01); B32B 2307/412 (2013.01); B32B 2310/0831 (2013.01); B32B 2311/00 (2013.01); B32B 2313/04 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01); Y10T 428/30 (2015.01);
Abstract
Provided is a manufacturing method of a laminated structure including a step of bonding a single layer or multiple layers of graphene formed on a first substrate to a second substrate through an adhesive layer including a delayed-curing UV curable resin by a roll-to-roll process.