The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Feb. 20, 2018
GM Global Technology Operations Llc, Detroit, MI (US);
University of Southern California, Los Angeles, CA (US);
Roger G. Ghanem, Los Angeles, CA (US);
Venkateshwar R. Aitharaju, Troy, MI (US);
Hamid G. Kia, Bloomfield Hills, MI (US);
GM Global Technology Operations LLC, Detroit, MI (US);
University of Southern California, Los Angeles, CA (US);
Abstract
Presented are manufacturing control systems for composite-material structures, methods for assembling/operating such systems, and transfer molding techniques for predicting and ameliorating void conditions in fiber-reinforced polymer panels. A method for forming a composite-material construction includes receiving a start signal indicating a fiber-based preform is inside a mold cavity, and transmitting a command signal to inject pressurized resin into the mold to induce resin flow within the mold cavity and impregnate the fiber-based preform. An electronic controller receives, from a distributed array of sensors attached to the mold, signals indicative of pressure and/or temperature at discrete locations on an interior face of the mold cavity. The controller determines a measurement deviation between a calibrated baseline value and the pressure and/or temperature values for each of the discrete locations. If any one of the respective measurement deviations exceeds a calibrated threshold, a void signal is generated to flag a detected void condition.