The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Dec. 17, 2013
Applicants:

Nederlandse Organisatie Voor Toegepast-natuurwetenschappelijk Onderzoek Tno, 's-Gravenhage, NL;

Henkel Ag & Co. Kgaa, Dusseldorf, DE;

Inventors:

Jeroen van den Brand, 's-Gravenhage, NL;

Ashok Sridhar, 's-Gravenhage, NL;

Anja Henckens, Zonhoven, BE;

Gunther Dreezen, Balen-Olmen, BE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/14 (2006.01); H01L 23/00 (2006.01); B29C 65/22 (2006.01); B29C 65/24 (2006.01); B29C 65/48 (2006.01); H05B 3/00 (2006.01); B29K 101/10 (2006.01); B29L 9/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/1403 (2013.01); B29C 65/221 (2013.01); B29C 65/245 (2013.01); B29C 65/4835 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H05B 3/0038 (2013.01); B29K 2101/10 (2013.01); B29L 2009/00 (2013.01); H01L 24/81 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29309 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29313 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/29388 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/29439 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/75283 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/8322 (2013.01); H01L 2224/8323 (2013.01); H01L 2224/83224 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83868 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/83874 (2013.01); H01L 2924/12042 (2013.01); Y10T 428/24752 (2015.01);
Abstract

The present disclosure relates to a method for curing a heat-curable material () in an embedded curing zone () and an assembly resulting from such method. The method comprises providing a heat-conducting strip () partially arranged between a component () and a substrate () that form the embedded curing zone () therein between. The heat-conducting strip () extends from the embedded curing zone () to a radiation-accessible zone () that is distanced from the embedded curing zone () and at least partially free of the component () and the substrate (). The method further comprises irradiating the heat-conducting strip () in the radiation-accessible zone () by means of electromagnetic radiation (). Heat () generated by absorption of the electromagnetic radiation () in the heat-conducting strip () is conducted from the radiation-accessible zone () along a length of the heat-conducting strip () to the embedded curing zone () to cure the heat-curable material () by conducted heat () emanating from the heat-conducting strip () into the embedded curing zone ().


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