The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2020
Filed:
Feb. 12, 2016
Applicant:
Yupo Corporation, Tokyo, JP;
Inventors:
Assignee:
YUPO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/24 (2006.01); B65D 65/40 (2006.01); G09F 3/04 (2006.01); B32B 27/00 (2006.01); C09J 7/29 (2018.01); B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01); B32B 7/12 (2006.01); B65D 25/36 (2006.01); G09F 3/10 (2006.01); B65D 1/00 (2006.01);
U.S. Cl.
CPC ...
B29C 49/24 (2013.01); B32B 7/12 (2013.01); B32B 27/00 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/205 (2013.01); B32B 27/32 (2013.01); B65D 25/36 (2013.01); B65D 65/40 (2013.01); C09J 7/29 (2018.01); G09F 3/04 (2013.01); G09F 3/10 (2013.01); B29K 2715/006 (2013.01); B32B 2264/10 (2013.01); B32B 2270/00 (2013.01); B32B 2307/31 (2013.01); B32B 2307/4023 (2013.01); B32B 2307/514 (2013.01); B32B 2307/516 (2013.01); B32B 2307/538 (2013.01); B32B 2519/00 (2013.01); B65D 1/00 (2013.01);
Abstract
A thermoplastic resin film of the present invention contains at least a base layer containing a thermoplastic resin and a heat seal layer containing a thermoplastic resin; a melting point of the thermoplastic resin contained in the heat seal layer is lower than a melting point of the thermoplastic resin of the base layer; a core roughness depth Rk of a surface of the heat seal layer being from 1.2 to 9.0 μm; and a ratio Rzjis/Rk of a ten point height of roughness profile Rzjis to a core roughness depth Rk of the surface of the heat seal layer measured in accordance with JIS B0601:2013 Appendix 1 being from 2.0 to 9.0.