The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 21, 2020

Filed:

Mar. 04, 2016
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Alvaro S. Domenighi, St. Paul, MN (US);

Kim L. Gustafson, Lake Stevens, WA (US);

Patrick G. Zimmerman, Mendota Heights, MN (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 44/18 (2006.01); B05C 17/005 (2006.01); B29C 39/02 (2006.01); B29L 31/60 (2006.01);
U.S. Cl.
CPC ...
B29C 44/186 (2013.01); B05C 17/00516 (2013.01); B29C 39/02 (2013.01); B29L 2031/60 (2013.01); B29L 2031/608 (2013.01);
Abstract

Nozzles are presented, for application of a setting resin into cells of a honeycomb core to provide the panel with reinforced segments. The nozzle comprises a connector portion and an application head, where the connector portion is adapted to receive setting resin from a resin dispensing device and deliver the setting resin to the application head, and the application head comprises: an exit hole, and a flange surrounding the exit hole. The flange comprises a bottom surface which comprises a planar surface which planar surface has a minimum width around the exit hole. The bottom surface of flange curves upward at its outer perimeter. In some embodiments, the nozzle is optically translucent or transparent. In addition, methods of applying a setting resin into cells of a honeycomb core to form a honeycomb core reinforcement are presented. In some embodiments, the setting resin is a low density void filler.


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