The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Jan. 12, 2018
Applicants:

Lite-on Electronics (Guangzhou) Limited, Guangzhou, CN;

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Yi-Feng Pu, Taipei, TW;

Tzu-Shu Lin, Taipei, TW;

Pei-Hsuan Huang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 3/12 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/02 (2006.01); H05K 3/20 (2006.01); B29C 69/02 (2006.01); B29C 45/14 (2006.01); B29L 31/34 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1275 (2013.01); H05K 1/185 (2013.01); H05K 3/0011 (2013.01); H05K 3/0014 (2013.01); H05K 3/025 (2013.01); H05K 3/207 (2013.01); H05K 3/32 (2013.01); H05K 3/4644 (2013.01); B29C 45/14639 (2013.01); B29C 69/02 (2013.01); B29L 2031/3425 (2013.01); H05K 1/095 (2013.01); H05K 3/28 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/0522 (2013.01); H05K 2203/085 (2013.01); H05K 2203/1105 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/178 (2013.01);
Abstract

A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure.


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