The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

May. 02, 2017
Applicant:

Generic Power Pte Ltd., Singapore, SG;

Inventors:

Hak Wee Tang, Singapore, SG;

Ruini Cao, Singapore, SG;

Kok Yeow Lim, Singapore, SG;

Zin Oo Thant, Singapore, SG;

Assignee:

GENERIC POWER PTE LTD, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 13/282 (2018.01); H01L 21/67 (2006.01); G06T 7/00 (2017.01); G06T 7/80 (2017.01); H04N 13/246 (2018.01); H04N 13/243 (2018.01); H01L 23/495 (2006.01); H04N 13/00 (2018.01);
U.S. Cl.
CPC ...
H04N 13/282 (2018.05); G06T 7/0006 (2013.01); G06T 7/80 (2017.01); H01L 21/67288 (2013.01); H04N 13/243 (2018.05); H04N 13/246 (2018.05); G06T 2207/10012 (2013.01); G06T 2207/30148 (2013.01); G06T 2207/30244 (2013.01); H01L 23/49555 (2013.01); H04N 2013/0081 (2013.01);
Abstract

The present invention includes a system and method for three-dimensional imaging and analysis of electronic components. Specifically, it permits rapid and reliable inspection of the lead foot angle in integrated circuit packages. A first image capturing device, a second image capturing device and a third image capturing device are arranged in a 'corner shape' or 'L-shape.' The first image capturing device forms the corner and obtains an image of the bottom of the component. The perspective viewing angle of the second image capturing device and the perspective viewing angle of the third image capturing device are orthogonal to each other to allow accurate three-dimensional reconstruction of the lead angles and detection of flaws or bends.


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