The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Sep. 08, 2017
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Christopher S. Graham, San Francisco, CA (US);

Demetrios B. Karanikos, San Francisco, CA (US);

Darshan R. Kasar, San Francisco, CA (US);

Paul J. Thompson, Mountain View, CA (US);

Eric S. Jol, San Jose, CA (US);

Grant S. Haug, Mountain View, CA (US);

Karl Ruben F. Larsson, Los Altos, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02J 7/00 (2006.01); H02J 50/10 (2016.01); H01F 27/28 (2006.01); H02J 7/02 (2016.01); H05K 9/00 (2006.01); H02J 50/40 (2016.01); H02J 50/60 (2016.01); H02J 50/70 (2016.01); H04B 5/00 (2006.01); H01F 27/32 (2006.01); H02J 5/00 (2016.01);
U.S. Cl.
CPC ...
H02J 7/0042 (2013.01); H01F 27/288 (2013.01); H01F 27/325 (2013.01); H02J 5/005 (2013.01); H02J 7/025 (2013.01); H02J 50/10 (2016.02); H02J 50/40 (2016.02); H02J 50/60 (2016.02); H02J 50/70 (2016.02); H04B 5/0037 (2013.01); H04B 5/0075 (2013.01); H04B 5/0087 (2013.01); H05K 9/0007 (2013.01);
Abstract

Embodiments describe a wireless charging device including: a housing having a charging surface and first and second walls that define an interior cavity; a transmitter coil arrangement disposed within the interior cavity, an interconnection structure positioned within the interior cavity below the transmitter coil arrangement, the interconnection structure including a plurality of packaged electrical components mounted on the interconnection structure and configured to operate the plurality of transmitter coils during wireless power transfer, where the plurality of packaged electrical components is located below the transmitter coil arrangement; and a frame comprising a plurality of openings positioned corresponding to the plurality of packaged electrical components, each opening providing space within which a respective packaged electrical device is disposed.


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