The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

May. 09, 2018
Applicant:

Ball Aerospace & Technologies Corp., Boulder, CO (US);

Inventors:

Gary A. Raney, Broomfield, CO (US);

Peter J. Moosbrugger, Lafayette, CO (US);

Bryce W. Unruh, Erie, CO (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 3/34 (2006.01); H01Q 21/06 (2006.01); H01L 23/367 (2006.01); H01Q 1/02 (2006.01); H01Q 21/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01); H01Q 9/04 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01Q 3/34 (2013.01); H01L 23/367 (2013.01); H01Q 1/02 (2013.01); H01Q 21/0075 (2013.01); H01Q 21/065 (2013.01); H05K 1/0203 (2013.01); H05K 1/0243 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 7/2029 (2013.01); H05K 7/20409 (2013.01); H05K 7/20436 (2013.01); H01L 23/42 (2013.01); H01Q 9/0435 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10545 (2013.01);
Abstract

Phased array antenna systems are disclosed. An antenna system as disclosed herein can include a plurality of antenna or radiating elements formed on a common plane comprising a first surface of a circuit board. Each antenna element has one or more feeds. Integrated circuits are placed on a second surface of the circuit board. Each integrated circuit is associated with one or more of the antenna elements. Signal lines connecting an integrated circuit to a feed of an antenna element can be shielded using interlayer ground planes and interlayer conductive plugs. In addition, back surfaces of the integrated circuits can be connected to a common heatsink using a thermally conductive medium.


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