The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Mar. 01, 2018
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventors:

Daisuke Sato, Anan, JP;

Atsushi Hashizume, Anan, JP;

Toshiki Nishihama, Anan, JP;

Shimpei Maeda, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/58 (2010.01); H01L 25/16 (2006.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 33/505 (2013.01); H01L 25/167 (2013.01); H01L 33/504 (2013.01); H01L 33/508 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/52 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/181 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A method of manufacturing a light emitting device, includes providing a light emitting element having an element upper surface, an element lower surface opposite to the element upper surface in a thickness direction of the light emitting element, and an element side surface between the element upper surface and the element lower surface. A wavelength converter having a converter lower surface is provided. The wavelength converter is joined to the light emitting element using an adhesive so that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface viewed along the thickness direction. The adhesive covers the element side surface and the exposed region.


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Sato, Daisuke. (2020). Method of manufacturing light emitting device (U.S. Patent No. 10714663). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10714663

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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