The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Oct. 25, 2018
Applicant:

Texas Tech University System, Lubbock, TX (US);

Inventors:

Hongxing Jiang, Lubbock, TX (US);

Jingyu Lin, Lubbock, TX (US);

Jing Li, Lubbock, TX (US);

Avisek Maity, Lubbock, TX (US);

Sam Grenadier, Lubbock, TX (US);

Assignee:

Texas Tech University System, Lubbock, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 31/115 (2006.01); G01T 3/08 (2006.01); H01L 31/0224 (2006.01); H01L 31/036 (2006.01); H01L 31/02 (2006.01); H01L 31/18 (2006.01); H01L 31/0304 (2006.01);
U.S. Cl.
CPC ...
H01L 31/115 (2013.01); G01T 3/08 (2013.01); H01L 31/02019 (2013.01); H01L 31/022408 (2013.01); H01L 31/036 (2013.01); H01L 31/03044 (2013.01); H01L 31/1856 (2013.01); H01L 31/1892 (2013.01);
Abstract

A method for fabricating a neutron detector includes providing an epilayer wafer of Boron-10 enriched hexagonal boron nitride (h-BN or h-BN orBN or BN) having a thickness (t), dicing or cutting the epilayer wafer into one or more BN strips having a width (W) and a length (L), and depositing a first metal contact on a first surface of at least one of the BN strip and a second metal contact on a second surface of the at least one BN strip. The neutron detector includes an electrically insulating submount, a BN epilayer of Boron-10 enriched hexagonal boron nitride (h-BN or h-BN orBN or BN) placed on the insulating submount, a first metal contact deposited on a first surface of the BN epilayer, and a second metal contact deposited on a second surface of the BN epilayer.


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