The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Jan. 11, 2018
Applicant:

Ams Sensors Singapore Pte. Ltd., Singapore, SG;

Inventors:

Tae Yong Ahn, Singapore, SG;

Sai Mun Chan, Singapore, SG;

Kyu Won Hwang, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2014.01); H01L 33/48 (2010.01); H01L 31/0232 (2014.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 27/146 (2006.01); H01L 31/18 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H01L 27/15 (2013.01); H01L 31/0232 (2013.01); H01L 31/02325 (2013.01); H01L 31/18 (2013.01); H01L 33/005 (2013.01); H01L 33/483 (2013.01); H01L 33/58 (2013.01);
Abstract

Optoelectronic modules, such as imaging cameras, proximity sensors, range cameras, structured-light/pattern generators, and image projectors, and methods for their manufacture, are disclosed. The optoelectronic modules exhibit particularly small dimensions. The optoelectronic modules include an optical assembly, an intermediate substrate, and a base substrate. The optical assembly includes a flange portion. An adhesive layer between the flange portion and the intermediate substrate, and an additional adhesive layer between the intermediate substrate and the base can be substantially non-transmissive to light and can resist dimensional changes dues to moisture absorption, for example.


Find Patent Forward Citations

Loading…