The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Feb. 22, 2019
Applicant:
Lapis Semiconductor Co., Ltd., Kanagawa, JP;
Inventor:
Tomoko Yonekura, Miyazaki, JP;
Assignee:
LAPIS SEMICONDUCTOR CO., LTD., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 29/423 (2006.01); H01L 23/00 (2006.01); H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/06 (2006.01); H01L 29/78 (2006.01); H01L 23/31 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4238 (2013.01); H01L 23/3157 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 29/0615 (2013.01); H01L 29/0619 (2013.01); H01L 29/0638 (2013.01); H01L 29/404 (2013.01); H01L 29/417 (2013.01); H01L 29/41741 (2013.01); H01L 29/7395 (2013.01); H01L 29/7802 (2013.01); H01L 29/7811 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/0382 (2013.01); H01L 2224/05558 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A semiconductor device including a semiconductor substrate; a conductive film covering a front face of the semiconductor substrate, a front face of the conductive film having plural straight-line shaped concave portions disposed in parallel to each other; and a protecting film covering the front face of the conductive film, the protecting film having an opening that has an edge forming an angle with the plural concave portions of greater than 0° and less than 90°, and that partially exposes the conductive film.