The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Mar. 15, 2017
Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Kenji Takeo, Kanagawa, JP;

Assignee:

SONY CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 21/027 (2006.01); G03F 7/16 (2006.01); H01L 31/0236 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14632 (2013.01); G03F 7/162 (2013.01); H01L 21/0271 (2013.01); H01L 27/146 (2013.01); H01L 27/14687 (2013.01); H01L 31/02366 (2013.01); H01L 21/0273 (2013.01);
Abstract

The present disclosure relates to a circuit board, a semiconductor device, an imaging device, a solid-state image sensor, a method for manufacturing a solid-state image sensor, and an electronic apparatus that suppress a decrease in characteristics and a yield. A step portion formed on a substrate surface is configured in a divided state. With this configuration, a photoresist liquid dropped in a lithography process flows through a gap between the divided step portions so that the photoresist liquid uniformly flows on an imaging surface, whereby a decrease in characteristics and a yield due to application unevenness can be suppressed. The present disclosure can be applied to a solid-state image sensor.


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