The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
May. 16, 2017
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Hiroyuki Shigeta, Kanagawa, JP;
Yuuji Nishitani, Kanagawa, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/14 (2006.01); H01L 23/00 (2006.01); H01L 27/148 (2006.01); H04N 5/374 (2011.01); H01L 27/146 (2006.01); H01L 23/12 (2006.01); H04N 5/369 (2011.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); H01L 23/12 (2013.01); H01L 23/142 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/32 (2013.01); H01L 24/97 (2013.01); H01L 27/148 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H04N 5/369 (2013.01); H04N 5/374 (2013.01); H01L 24/13 (2013.01); H01L 24/81 (2013.01); H01L 2224/13101 (2013.01); H01L 2224/14135 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81951 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15173 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/18161 (2013.01);
Abstract
This semiconductor chip package has opposed first surface and second surface, and includes a semiconductor chip having a circuit part and an electrode for supplying a voltage to the circuit part, a resin layer formed in a periphery of the semiconductor chip, a substrate that is disposed to face the first surface of the semiconductor chip and the resin layer, and a plurality of external terminals that are provided on the second surface of the semiconductor chip, each of the plurality of external terminals being electrically coupled to any of the plurality of electrodes.