The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Feb. 05, 2019
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Soo Hwan Son, Suwon-si, KR;

Seung Hyun Ra, Suwon-si, KR;

Kyoung Jin Jun, Suwon-si, KR;

Sang Soo Park, Suwon-si, KR;

Young Key Kim, Suwon-si, KR;

Soon Ju Lee, Suwon-si, KR;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/38 (2006.01); H01G 4/012 (2006.01); H01G 4/30 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01G 2/06 (2006.01); H01G 4/232 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/38 (2013.01); H01G 2/065 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 1/117 (2013.01); H05K 1/181 (2013.01); H01G 4/12 (2013.01); H05K 2201/10015 (2013.01);
Abstract

A laminated electronic component includes a first capacitor including a first ceramic body, first external electrodes disposed on upper and lower surfaces of the first ceramic body, and second external electrodes disposed apart from the first external electrodes on the upper and lower surfaces of the first ceramic body, and a second capacitor including a second ceramic body, a third external electrode disposed on a lower surface of the second ceramic body, and a fourth external electrode disposed apart from the third external electrode on the lower surface of the second ceramic body, and disposed on the first capacitor and electrically connected to the first capacitor. A current loop passing through the upper surface of the first ceramic body and the lower surface of the second ceramic body is formed.


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