The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Jul. 11, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06N 3/08 (2006.01); H01L 21/66 (2006.01); G01N 21/95 (2006.01); G06K 9/62 (2006.01); G01N 21/956 (2006.01); H01L 21/67 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G01N 21/9501 (2013.01); G01N 21/95607 (2013.01); G06K 9/627 (2013.01); G06N 3/08 (2013.01); H01L 22/20 (2013.01); G01N 2021/8854 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/30148 (2013.01); H01L 21/67288 (2013.01); H01L 22/12 (2013.01);
Abstract
A semiconductor defect classification device includes feature extractors that are configured to receive images of semiconductor patterns on a wafer and to extract features of the images from the images, and a classifier that is configured to receive the features of the images and first meta information about the wafer and to use machine learning to classify a defect of the semiconductor patterns associated with the images based on the features of the images and the first meta information.