The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Sep. 18, 2018
Applicant:

Idex Asa, Fornebu, NO;

Inventors:

Fred G. Benkley, III, Middleton, MA (US);

David N. Light, Los Gatos, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H04M 1/02 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); G06K 9/00006 (2013.01); G06K 9/0012 (2013.01); G06K 9/00053 (2013.01); H01L 23/5387 (2013.01); H04M 1/0277 (2013.01);
Abstract

A sensor assembly includes a flexible substrate with conductive traces formed on opposed sides of the substrate and oriented transversely to each other. The substrate is wrapped around a core so that the traces formed on opposed sides of a first part of the substrate form a first sensor surface on one surface of the core, and the traces formed on opposed sides of a second part of the substrate form a second sensor surface on an opposed surface of the core. The core may comprise an encapsulant overmolded onto the conductive traces on a surface of the first part of the substrate, and the second part of the substrate is folded over the encapsulant. The sensor assembly may include an integrated circuit disposed on the flexible substrate, wherein one or more of the conductive traces are electrically connected to each integrated circuit.


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