The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Sep. 13, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Gerald Bartley, Rochester, MN (US);

Matthew Doyle, Chatfield, MN (US);

Darryl Becker, Rochester, MN (US);

Mark Jeanson, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H05K 3/42 (2006.01); G03F 1/38 (2012.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/16 (2006.01); G03F 7/26 (2006.01); G03F 7/40 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
G03F 7/20 (2013.01); G03F 1/38 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/16 (2013.01); G03F 7/26 (2013.01); G03F 7/405 (2013.01); H05K 3/4038 (2013.01); H05K 3/428 (2013.01); H05K 3/424 (2013.01); H05K 3/429 (2013.01); H05K 2201/09645 (2013.01); H05K 2203/0514 (2013.01); H05K 2203/0562 (2013.01); H05K 2203/1383 (2013.01);
Abstract

The present invention provides a process and a structure of forming conductive vias using a light guide. In an exemplary embodiment, the process includes providing a via in a base material in a direction perpendicular to a plane of the base material, applying a photoresist layer to an interior surface of the via, inserting a light guide into the via, exposing, by the light guide, a portion of the photoresist layer to light, thereby resulting in an exposed portion of the photoresist layer and an unexposed portion of the photoresist layer, removing a portion of the photoresist layer, and plating an area of the via, where the photoresist has been removed, with a metal, thereby resulting in a portion of the via plated with metal and a portion of the via not plated with metal.


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