The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10712525 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 14, 2020

Filed:

Mar. 27, 2015
Applicants:

Albert Ting, Amesbury, MA (US);

Daniel T. Mccormick, Richmond, CA (US);

Michael Rattner, San Francisco, CA (US);

Inventors:

Albert Ting, Amesbury, MA (US);

Daniel T. McCormick, Richmond, CA (US);

Michael Rattner, San Francisco, CA (US);

Assignee:

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 7/02 (2006.01); B81C 3/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); G02B 3/00 (2006.01); G02B 27/00 (2006.01);
U.S. Cl.
CPC ...
G02B 7/023 (2013.01); B81B 7/0067 (2013.01); B81C 1/00317 (2013.01); B81C 3/002 (2013.01); G02B 3/0087 (2013.01); G02B 7/028 (2013.01); G02B 27/0006 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A method and apparatus for packaging a MEMS device is disclosed that includes a MEMS die mounting surface, a MEMS device disposed on the mounting surface, and a fluid contained within the package and surrounding at least a portion of the MEMS device. The fluid may be selected to provide certain advantageous features. For example, the fluid may have a selected index of refraction that is matched with a lens index of refraction of the lens, have a viscosity selected to provide a predetermined mechanical damping to the MEMS device, be thermally coupled with the MEMS device and configured to remove heat from the MEMS device. The fluid may also be configured in mechanical cooperation with a spring mounted scanning element, a linear translation actuator, a rotational actuator, a lens, etc. to actuate or apply fluidic pressure to such elements.


Find Patent Forward Citations

Ting, Albert. (2020). Packaging mems in fluidic environments (U.S. Patent No. 10712525). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10712525

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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