The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Nov. 27, 2018
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Selaka Bandara Bulumulla, Niskayuna, NY (US);

Md Sayed Kaysar Bin Rahim, Malta, NY (US);

Tanya Andreeva Atanasova, Saratoga Springs, NY (US);

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 23/00 (2006.01); G02B 6/122 (2006.01); H01L 23/522 (2006.01); H01L 23/64 (2006.01); H01L 49/02 (2006.01); G02B 6/13 (2006.01);
U.S. Cl.
CPC ...
G02B 6/1225 (2013.01); G02B 6/13 (2013.01); H01L 23/5226 (2013.01); H01L 23/5227 (2013.01); H01L 23/645 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 28/10 (2013.01); G02B 2006/1213 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12166 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2924/1206 (2013.01); H01L 2924/1425 (2013.01);
Abstract

The present disclosure relates to packaging of integrated circuit chips for semiconductor devices. More particularly, the present disclosure relates to packaging of multiple chips for silicon photonics devices. The present disclosure provides a semiconductor device including a photonic integrated circuit (PIC) chip, an inductor positioned over the PIC chip, and a transimpedance amplifier (TIA) chip positioned over the PIC chip. The inductor has a first terminal end and a second terminal end, and the first terminal end is connected to the PIC chip.


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