The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Nov. 20, 2014
Hongyu Yu, Chandler, AZ (US);
Hai Huang, Sunnyvale, CA (US);
Arizona Board of Regents on behalf of Arizona State University, Scottsdale, AZ (US);
Abstract
The invention relates to microfabrication technology for producing sensing cells, for use, for example, in molecular electronic transducer (MET) based seismometers devices. In some aspects, a method for fabricating a sensing element is provided. The method includes providing a first wafer including a first substrate, a second substrate, and a first insulating layer between therebetween, etching a first fluid throughhole through the first substrate, the first insulating layer, and the second substrate, and coating the first substrate and second substrate with a first and second conductive coating, respectively. The method also includes providing a second wafer including a third substrate, a fourth substrate, and a second insulating layer therebetween, etching a second fluid throughhole through the third substrate, the second insulating layer, and the fourth substrate, and coating the third substrate with a third conductive coating from top and the fourth substrate with a fourth conductive coating from back.