The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Jan. 19, 2017
Applicant:

Sicpa Holding SA, Prilly, CH;

Inventors:

Davide Ciampini, Arnad, IT;

Livio Cognolato, Arnad, IT;

Luigi Vitalbo, Arnad, IT;

Assignee:

SICPA HOLDING SA, Prilly, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); B01L 3/00 (2006.01); C08L 33/06 (2006.01); C09J 5/00 (2006.01); C09J 11/08 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B01L 3/50 (2013.01); C08L 33/06 (2013.01); C09J 5/00 (2013.01); C09J 11/08 (2013.01); B01L 2200/0689 (2013.01); B01L 2200/12 (2013.01); C08L 63/00 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); C09J 2483/00 (2013.01);
Abstract

The present invention relates to a biomedical device for the distribution or containment of biological substances comprising at least two components assembled each other with an adhesive composition comprising a mixture of an acrylic adhesive composition and an epoxy adhesive composition. The present invention also relates to a method for assembling a biomedical device comprising at least two components, comprising (i) forming a film of an adhesive composition comprising a mixture of a (meth)acrylate adhesive composition and an epoxy adhesive composition on at least one surface of said at least two components, (ii) pre-curing said adhesive composition with an UV-blue radiation exposure to substantially cure said (meth)acrylate adhesive composition without substantially curing said epoxy adhesive composition, (iii) contacting said at least one surface of said at least two components to be assembled, and (iv) completing the curing of said adhesive composition with an UV-blue radiation exposure.


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