The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Oct. 06, 2014
Applicant:

Daicel Corporation, Osaka-shi, Osaka, JP;

Inventors:

Yousuke Ito, Himeji, JP;

Hiroki Tanaka, Himeji, JP;

Kiyoharu Tsutsumi, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J 5/06 (2006.01); C09J 4/00 (2006.01); C09J 5/00 (2006.01); C09J 201/02 (2006.01); C09J 11/06 (2006.01); C09J 125/08 (2006.01); C09J 125/18 (2006.01); C09J 133/06 (2006.01);
U.S. Cl.
CPC ...
C09J 5/06 (2013.01); C09J 4/00 (2013.01); C09J 5/00 (2013.01); C09J 11/06 (2013.01); C09J 125/08 (2013.01); C09J 125/18 (2013.01); C09J 133/066 (2013.01); C09J 201/02 (2013.01); C09J 2203/326 (2013.01);
Abstract

Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows:


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