The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 2020

Filed:

Sep. 30, 2016
Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Takayuki Maeda, Shiga, JP;

Kenji Yamauchi, Yamaguchi, JP;

Shiori Tateno, Shiga, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 29/14 (2006.01); C08F 8/28 (2006.01); C08L 63/00 (2006.01); C09J 129/04 (2006.01); C09J 129/14 (2006.01); C09J 163/00 (2006.01); C08L 29/04 (2006.01); C08F 8/06 (2006.01); C08F 16/28 (2006.01); C08F 216/38 (2006.01);
U.S. Cl.
CPC ...
C08L 29/14 (2013.01); C08F 8/28 (2013.01); C08L 29/04 (2013.01); C08L 63/00 (2013.01); C09J 129/04 (2013.01); C09J 129/14 (2013.01); C09J 163/00 (2013.01); C08F 8/06 (2013.01); C08F 16/28 (2013.01); C08F 216/38 (2013.01);
Abstract

The present invention aims to provide a modified polyvinyl acetal resin composition that is excellent in storage stability, has high strength and excellent adhesiveness, and is capable of reducing occurrence of warping or peeling when used for bonding different materials. The present invention relates to a modified polyvinyl acetal resin composition containing: a modified polyvinyl acetal resin having a constitutional unit with an imine structure, and an epoxy resin.


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