The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2020
Filed:
Mar. 15, 2016
Applicant:
National University of Ireland, Galway, Galway, IE;
Inventors:
Gerard O'Connor, Galway, IE;
Adam Collins, Galway, IE;
Assignee:
National University of Ireland, Galway, Galway, IE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03B 33/02 (2006.01); B23K 26/0622 (2014.01); B23K 26/073 (2006.01); B23K 26/364 (2014.01); B23K 26/402 (2014.01); B23K 26/08 (2014.01); B23K 26/082 (2014.01); B23K 101/18 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
C03B 33/0222 (2013.01); B23K 26/0624 (2015.10); B23K 26/0736 (2013.01); B23K 26/082 (2015.10); B23K 26/083 (2013.01); B23K 26/0838 (2013.01); B23K 26/364 (2015.10); B23K 26/402 (2013.01); B23K 2101/18 (2018.08); B23K 2103/54 (2018.08);
Abstract
Methods and apparatus for cutting a substrate are disclosed. In one arrangement, a plurality of recesses are formed in the surface of the substrate. The recesses as such that a stress can be applied to the substrate that is concentrated by the recesses. The concentrated stress causes the substrate to be cut along a cutting line that passes through the recesses. The cutting occurs via propagation of a crack through the recesses.