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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10710324 B1

PDFFull Text
Date of Patent:
Jul. 14, 2020

Filed:

Jan. 25, 2017

Manufacturing method of honeycomb structure forming die, and honeycomb structure forming die

Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Toshihiro Hirakawa, Nagoya, JP;

Toshio Yamada, Nagoya, JP;

Yukio Miyairi, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:

Burr & Brown, PLLC

Primary Examiner:

Michael M Robinson

Int. Cl.
CPC ...
B29D 99/00 (2010.01); B29C 48/11 (2019.01); B29C 48/30 (2019.01); B29L 31/60 (2006.01); B29L 31/00 (2006.01); B29C 48/00 (2019.01);
U.S. Cl.
CPC ...
B29D 99/0089 (2013.01); B29C 48/11 (2019.02); B29C 48/30 (2019.02); B29C 48/022 (2019.02); B29D 99/0003 (2013.01); B29L 2031/608 (2013.01); B29L 2031/757 (2013.01);
Abstract

A manufacturing method of a honeycomb structure forming die includes a linear slit forming step of forming, in a kneaded material discharging surface of a die substrate, a plurality of linear slits which are straight from one end to the other end on the kneaded material discharging surface, a slit sealing material disposing step of disposing a slit sealing material in parts of the plurality of linear slits, and a back hole forming step of forming back holes to introduce a kneaded material, in a kneaded material introducing surface of the die substrate which is present on a side opposite to the kneaded material discharging surface.

Find Patent Forward Citations

Hirakawa, Toshihiro. (2020). Manufacturing method of honeycomb structure forming die, and honeycomb structure forming die (U.S. Patent No. 10710324). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10710324

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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