The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 19, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Hyelim Yun, Suwon-si, KR;

Bongkyu Min, Suwon-si, KR;

Dohoon Kim, Suwon-si, KR;

Taewoo Kim, Suwon-si, KR;

Jinyong Park, Suwon-si, KR;

Jungje Bang, Suwon-si, KR;

Hyeongju Lee, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 9/00 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 7/14 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0032 (2013.01); H05K 1/115 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 7/1427 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10378 (2013.01);
Abstract

Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board. The outer surface of the interposer includes a first conductive region electrically connected with at least one first through hole of the one or more through holes, and a non-conductive region, the inner surface of the interposer includes a second conductive region electrically connected with at least one second through hole of the one or more through holes, and the second conductive region includes a region facing the non-conductive region.


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