The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Jul. 02, 2018
Applicant:

Magna Electronics Inc., Auburn Hills, MI (US);

Inventors:

Matthew C. Sesti, Williamston, MI (US);

Robert A. Devota, Durand, MI (US);

Yuesheng Lu, Farmington Hills, MI (US);

Steven V. Byrne, Goodrich, MI (US);

Joel S. Gibson, Linden, MI (US);

Assignee:

MAGNA ELECTRONICS INC., Auburn Hills, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); G02B 7/02 (2006.01); G02B 7/04 (2006.01); G02B 13/00 (2006.01); G02B 27/00 (2006.01); H01L 27/146 (2006.01); B60R 11/04 (2006.01); G02B 27/62 (2006.01); G02B 7/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2254 (2013.01); B60R 11/04 (2013.01); G02B 7/003 (2013.01); G02B 7/02 (2013.01); G02B 7/025 (2013.01); G02B 7/04 (2013.01); G02B 13/001 (2013.01); G02B 27/0025 (2013.01); G02B 27/62 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H04N 5/2252 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01); H01L 2924/0002 (2013.01); Y10T 29/49002 (2015.01);
Abstract

A method of assembling a vehicular camera includes providing a printed circuit board and dispensing an adhesive in an uncured state at the printed circuit board. A front camera housing is mated with the circuit board, and the lens optics are aligned with respect to the imaging array at the circuit board by utilizing a multi-axis positioning device operable to translate the circuit board or lens assembly relative to the other along one or more orthogonal translational axes and manipulate the circuit board or lens assembly relative to the other about one or more orthogonal rotational axes. After aligning the lens optics with respect to the imaging array, the adhesive is cured to a first cure level and the joined lens assembly and the front camera housing are moved to a further curing station, where the adhesive is further cured to a second cure level.


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