The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Dec. 07, 2016
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Yukinobu Tarui, Chiyoda-ku, JP;
Makoto Kimura, Chiyoda-ku, JP;
Isamu Ryokawa, Shinagawa-ku, JP;
Akimichi Hirota, Chiyoda-ku, JP;
Hiroyuki Mizutani, Chiyoda-ku, JP;
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Abstract
A microwave module includes an RF device and a multilayer resin substrate. The device includes a metal cover covering at least an internal circuit. The substrate includes a first end face on a side of the device, a second end face on a side opposite to the first end face, a signal through-holes surrounding the circuit and connected to the circuit, ground through-holes surrounding the signal through-holes and connected to the cover, a first surface ground provided on the first end face and connected to the cover, an inner layer surface ground connected to ground through-holes, and an RF transmission line surrounded by the ground through-holes, the first surface ground, and the inner layer surface ground, and connected to the signal through-hole.