The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Nov. 17, 2017
Applicant:

Current Lighting Solutions, Llc, East Cleveland, OH (US);

Inventors:

Eden Dubuc, Lachine, CA;

Hubert Cardinal, Lachine, CA;

Assignee:

CURRENT LIGHTING SOLUTIONS, LLC, East Cleveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/20 (2006.01); H01L 25/075 (2006.01); H01R 43/048 (2006.01); H01R 4/18 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01R 43/205 (2013.01); H01L 25/0753 (2013.01); H01R 4/186 (2013.01); H01R 43/048 (2013.01); H05K 3/284 (2013.01); H05K 3/32 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/0228 (2013.01);
Abstract

Provided is a method for providing a wire connection to a printed circuit board. The method includes attaching a first end of a wire at a first location on the printed circuit board and attaching a second end of the wire at a second location of the printed circuit board, to form an arched wire. The method further includes applying an encapsulant on the printed circuit board, the encapsulant forming a film through which the arched wire protrudes. Furthermore, the method includes cutting the arched wire to yield an out-of-plane wire connected to the printed circuit board.


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