The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Dec. 15, 2016
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventor:
Yoshiharu Suemori, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/053 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); H05K 3/28 (2006.01); H01L 41/047 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H05K 3/30 (2006.01); H03H 9/10 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0533 (2013.01); H01L 23/564 (2013.01); H01L 41/0472 (2013.01); H01L 41/0475 (2013.01); H01L 41/0477 (2013.01); H05K 3/281 (2013.01); H05K 3/284 (2013.01); H05K 3/3436 (2013.01); H01L 23/3121 (2013.01); H01L 25/16 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H03H 9/1085 (2013.01); H05K 3/303 (2013.01); H05K 3/3442 (2013.01); H05K 3/3494 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10068 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/1178 (2013.01); H05K 2203/1311 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1322 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11);
Abstract
An electronic component-containing module includes a board, electronic components, and a sealing resin and includes a space provided between the board and at least one of the electronic components. The dryness factor of the sealing resin is about 60% or more where, after the electronic component-containing module is moisturized, the electronic component-containing module is heated to the re-melting temperature of a brazing filler metal.