The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 06, 2018
Applicant:

Glo Ab, Lund, SE;

Inventors:

Fariba Danesh, Los Altos Hills, CA (US);

Benjamin Leung, Sunnyvale, CA (US);

Tsun Lau, Sunnyvale, CA (US);

Zulal Tezcan, Sunnyvale, CA (US);

Miao-Chan Tsai, Sunnyvale, CA (US);

Max Batres, Fremont, CA (US);

Michael Joseph Cich, Fremont, CA (US);

Assignee:

GLO AB, Lund, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01); H01L 33/08 (2010.01); H01L 33/32 (2010.01); H01L 33/10 (2010.01); H01L 25/13 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/24 (2010.01); H01L 27/15 (2006.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01); H01L 25/0753 (2013.01); H01L 25/13 (2013.01); H01L 27/156 (2013.01); H01L 33/0075 (2013.01); H01L 33/08 (2013.01); H01L 33/10 (2013.01); H01L 33/24 (2013.01); H01L 33/32 (2013.01); H01L 33/62 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A method of forming a light emitting device includes forming a growth mask layer including openings on a doped compound semiconductor layer, forming first light emitting diode (LED) subpixels by forming a plurality of active regions and second conductivity type semiconductor material layers employing selective epitaxy processes, and transferring each first LED subpixel to a backplane. An anode contact electrode may be formed on the second conductivity type semiconductor material layers for redundancy. The doped compound semiconductor layer may be patterned with tapered sidewalls to enhance etendue. An optically clear encapsulation matrix may be formed on the doped compound semiconductor material layer to enhance etendue. Lift-off processes may be employed for the active regions. Cracking of the LEDs may be suppressed employing a thick reflector layer.


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