The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Dec. 01, 2018
Applicant:

Rfhic Corporation, Anyang, KR;

Inventor:

Won Sang Lee, Chapel Hill, NC (US);

Assignee:

RFHIC CORPORATION, Anyang, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/417 (2006.01); H01L 29/778 (2006.01); H01L 29/06 (2006.01); H01L 23/00 (2006.01); H01L 27/085 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 27/06 (2006.01); H01L 29/20 (2006.01); H01L 29/205 (2006.01); H01L 29/66 (2006.01); H01L 21/8232 (2006.01); H01L 21/8252 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/404 (2013.01); H01L 21/76898 (2013.01); H01L 21/8232 (2013.01); H01L 23/481 (2013.01); H01L 24/05 (2013.01); H01L 27/0605 (2013.01); H01L 27/085 (2013.01); H01L 29/0619 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/401 (2013.01); H01L 29/408 (2013.01); H01L 29/4175 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01); H01L 29/7787 (2013.01); H01L 21/8252 (2013.01); H01L 21/823481 (2013.01); H01L 24/03 (2013.01); H01L 24/29 (2013.01); H01L 24/94 (2013.01); H01L 29/0657 (2013.01); H01L 29/402 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/0508 (2013.01); H01L 2224/05027 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05084 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/05583 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29009 (2013.01); H01L 2224/29022 (2013.01); H01L 2224/29025 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/94 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10344 (2013.01); H01L 2924/13064 (2013.01);
Abstract

HEMT having a drain field plate is provided. The drain field plate is formed in the area between the gate and drain of a HEMT. The drain field plate includes a metal pad that has a larger projection area than the drain pad. The drain field plate and semiconductor layer disposed beneath the drain field plate form a metal-semiconductor (M-S) Schottky structure. The capacitance of the M-S Schottky structure generates capacitance in the semiconductor area, which increases the breakdown voltage of the transistor components of the HEMT. A portion of the substrate under the active area may be removed to thereby increase the heat conductivity and reduce the junction temperature of the transistor components of the HEMT.


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