The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Sep. 15, 2018
Applicant:

Nanchang O-film Optical-electronic Tech Co., Ltd., Nanchang, CN;

Inventors:

Chengzhe Shen, Nanchang, CN;

Jun Feng, Nanchang, CN;

Shumin Zhu, Nanchang, CN;

Shengyun Zhang, Nanchang, CN;

Wenhua Shuai, Nanchang, CN;

Dong Tang, Nanchang, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/225 (2006.01); H01L 23/00 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 24/48 (2013.01); H01L 27/14625 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); H05K 3/32 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/00014 (2013.01);
Abstract

A camera module includes a circuit board; a photosensitive chip coupled to the circuit board, a package material body attached on the circuit board, and a support member mounted on the package material body. The package material body has a photosensitive surface, which includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body away from the package material body is coplanar with the extension structure. An orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.


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