The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Nov. 21, 2018
Applicant:
Butterfly Network, Inc., Guilford, CT (US);
Inventors:
Jonathan M. Rothberg, Guilford, CT (US);
Keith G. Fife, Palo Alto, CA (US);
Nevada J. Sanchez, Guilford, CT (US);
Susan A. Alie, Stoneham, MA (US);
Assignee:
Butterfly Network, Inc., Guilford, CT (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81B 7/00 (2006.01); H01L 21/56 (2006.01); H01L 21/8238 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 27/06 (2006.01); B06B 1/02 (2006.01); H01L 27/092 (2006.01); B81C 1/00 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); A61B 8/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0617 (2013.01); A61B 8/00 (2013.01); A61B 8/4494 (2013.01); B06B 1/02 (2013.01); B06B 1/0292 (2013.01); B81B 3/0021 (2013.01); B81B 7/0006 (2013.01); B81C 1/00158 (2013.01); B81C 1/00246 (2013.01); H01L 21/32134 (2013.01); H01L 21/56 (2013.01); H01L 21/768 (2013.01); H01L 21/76838 (2013.01); H01L 21/823871 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/0688 (2013.01); H01L 27/092 (2013.01); B06B 2201/51 (2013.01); B81B 2201/0271 (2013.01); B81C 2203/0735 (2013.01); B81C 2203/0771 (2013.01); H01L 2224/16225 (2013.01);
Abstract
Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.