The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Apr. 10, 2018
Applicant:

Glo Ab, Lund, SE;

Inventors:

Tsun Lau, Sunnyvale, CA (US);

Fariba Danesh, Pleasanton, CA (US);

Timothy Gallagher, Los Altos Hills, CA (US);

Anusha Pokhriyal, Sunnyvale, CA (US);

Assignee:

GLO AB, Lund, SE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 24/83 (2013.01); H01L 33/0079 (2013.01); H01L 33/62 (2013.01); H01L 33/0025 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83224 (2013.01); H01L 2224/83815 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A backplane can have a non-planar top surface. Insulating material portions including planar top surface regions located within a same horizontal plane are formed over the backplane. A two-dimensional array of metal plate clusters is formed over the insulating material portions. Each of the metal plate clusters includes a plurality of metal plates. Each metal plate includes a horizontal metal plate portion overlying a planar top surface region and a connection metal portion connected to a respective metal interconnect structure in the backplane. A two-dimensional array of light emitting device clusters is bonded to the backplane through respective bonding structures. Each light emitting device cluster includes a plurality of light emitting devices overlying a respective metal plate cluster.


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