The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Oct. 24, 2016
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/057 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/28 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/057 (2013.01); H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/28 (2013.01); H01L 23/3121 (2013.01); H01L 23/48 (2013.01); H01L 23/49844 (2013.01);
Abstract
First and second electrodes () are provided on an upper surface of the semiconductor chip () and spaced apart from each other. A wiring member () includes a first joint () bonded to the first electrode () and a second joint () bonded to the second electrode (). Resin () seals the semiconductor chip (), the first and second electrodes () and the wiring member (). A hole () extending through the wiring member () up and down is provided between the first joint () and the second joint ().