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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10707097 B1

PDFFull Text
Date of Patent:
Jul. 07, 2020

Filed:

Jun. 19, 2018

Substrate processing apparatus

Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Hitoshi Nakai, Kyoto, JP;

Yasuhiko Ohashi, Kyoto, JP;

Assignee:

SCREEN Holdings Co., Ltd., , JP;

Attorney:

Ostrolenk Faber LLP

Primary Examiner:

Laura Edwards

Int. Cl.
CPC ...
H01L 21/67 (2006.01); B05C 11/10 (2006.01); H01L 21/687 (2006.01); B08B 3/04 (2006.01); B08B 11/00 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); B05C 5/02 (2006.01); B05C 9/04 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67023 (2013.01); B05C 11/1039 (2013.01); B05C 11/1044 (2013.01); B08B 3/041 (2013.01); B08B 11/00 (2013.01); H01L 21/02057 (2013.01); H01L 21/30604 (2013.01); H01L 21/6708 (2013.01); H01L 21/67051 (2013.01); H01L 21/68728 (2013.01); H01L 21/68764 (2013.01); B05C 5/02 (2013.01); B05C 9/04 (2013.01); H01L 21/00 (2013.01); H01L 21/67178 (2013.01);
Abstract

A substrate processing apparatus includes a chamber, a substrate holding part, a substrate rotating mechanism, and a processing liquid supply part. The chamber includes a chamber body and a chamber cover, and the chamber cover is moved up and down by a chamber opening and closing mechanism. A top plate is attached to the chamber cover. While the chamber cover is in contact with the chamber body, a sealed space is formed and processing is performed. When the chamber cover is moved up, an annular opening is formed between the chamber cover and the chamber body. A cup part is positioned outside the annular opening. A processing liquid spattering from a substrate is received by the cup part.

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