The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Mar. 27, 2018
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Sebastian Meier, Munich, DE;

Michael Hans Enzelberger-Heim, Munich, DE;

Reiner Port, Freising, DE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/311 (2006.01); H01L 21/02 (2006.01); H01L 21/3205 (2006.01); H01L 23/00 (2006.01); G01N 27/414 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); G01N 27/4146 (2013.01); H01L 21/0228 (2013.01); H01L 21/02175 (2013.01); H01L 21/02178 (2013.01); H01L 21/02181 (2013.01); H01L 21/02183 (2013.01); H01L 21/02186 (2013.01); H01L 21/02189 (2013.01); H01L 21/32051 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/45 (2013.01); H01L 2224/02206 (2013.01); H01L 2224/02215 (2013.01); H01L 2224/03019 (2013.01); H01L 2224/0381 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05164 (2013.01); H01L 2224/05169 (2013.01); H01L 2224/05173 (2013.01); H01L 2224/05176 (2013.01); H01L 2224/05178 (2013.01); H01L 2224/05183 (2013.01); H01L 2224/4502 (2013.01); H01L 2924/0534 (2013.01); H01L 2924/0535 (2013.01); H01L 2924/05341 (2013.01); H01L 2924/05342 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/13073 (2013.01);
Abstract

A microelectronic device includes a metal layer on a first dielectric layer. An etch stop layer is disposed over the metal layer and on the dielectric layer directly adjacent to the metal layer. The etch stop layer includes a metal oxide, and is less than 10 nanometers thick. A second dielectric layer is disposed over the etch stop layer. The second dielectric layer is removed from an etched region which extends down to the etch stop layer. The etched region extends at least partially over the metal layer. In one version of the microelectronic device, the etch stop layer may extend over the metal layer in the etched region. In another version, the etch stop layer may be removed in the etched region. The microelectronic device is formed by etching the second dielectric layer using a plasma etch process, stopping on the etch stop layer.


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