The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
Mar. 12, 2018
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/30 (2006.01); H01G 4/248 (2006.01); H01G 4/232 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/008 (2006.01);
U.S. Cl.
CPC ...
H01G 4/2325 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/30 (2013.01); H01G 4/0085 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H01G 4/1245 (2013.01);
Abstract
An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer and a conductive resin layer. The conductive resin layer is formed over the sintered metal layer and the element body. An average thickness of the conductive resin layer is smaller than that of the sintered metal layer.